主要特點(diǎn)：

用于LED 行業(yè)外延片背減薄加工，穩(wěn)定配套日本、韓國(guó)、中國(guó)臺(tái)灣主流研磨機(jī)，可加工2 寸、4 寸、6寸外延片。減薄效率高，表面質(zhì)量好。砂輪質(zhì)量穩(wěn)定，不易深刮、碎片。砂輪壽命高，具有*性價(jià)比，可大幅降低單片加工成本。砂輪主要性能已達(dá)到或超過(guò)進(jìn)口同類(lèi)產(chǎn)品水平。

加工對(duì)象：藍(lán)寶石襯底外延片、SiC 襯底外延片、Si 襯底外延片等。

工件材料：人造藍(lán)寶石、SiC、單晶硅等。

配套研磨機(jī)：NTS、WEC、凱勒斯(GALAXY)、創(chuàng)技(SPEEDFAM)、岡本(OKAMOTO) 等。

Characteristics:

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer, Carborundum wafer, GaAs and GaN wafer. This kind of grinding wheel developed in our company can replace imported products. They can be used steadily on the Japanese, Korean grinders with high performance.

Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.

Material of workpiece: Synthetic sapphire, SiC,single crystal silicon.

Grinders: SHUWA , NTS , WEC , GALAXY ,SPEEDFAM , OKAMOTO.

產(chǎn)品規(guī)格Specification