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詳細介紹
機型簡介
Model introduction
| 版本號 Version number | 更新日期 Updated | 更新人 Updater | 更新說明 Release Notes | |
| V1.1 | August 2019 | Min | ||
| V1.2 | November2019 | Chen | ||
| V1.3 | January2020 | Chen | ||
1.1 紫外激光打標機簡介 Introduction of UV laser marking machine
紫外激光打標機采用三階腔內(nèi)倍頻技術(shù)輸出波長為355nm紫外激光器，355nm紫外光聚焦光斑極小，能在很大程度上降低材料的機械變形且加工熱影響小。
Compared with the infrared laser,the three order intracavity frequency doubling technology is used in the UV laser marking machine,and the focus of the 355 UV light spot is very small,which can reduce the mechanical deformations of the material to a great extent.
1.2 紫外激光打標機的主要配置 Main configuration of ultraviolet laser marking machine
紫外激光打標機主要由機柜、紫外激光器、軟件控制卡、工控電腦、顯示屏、冷水機，放工件的水平臺等組成。
The ultraviolet laser marking machine is mainly composed of a cabinet, an ultraviolet laser, a software control card, an industrial control computer, a display screen, a chiller, and a water platform for placing workpieces.
1.3紫外激光打標機特點 Characteristics of UV laser marking machine
1.紫外激光由于聚焦斑極小，加工熱影響小，因而可以進行超精細打標、特殊材料打標，是對打標效果有更高的要求客戶的產(chǎn)品；
pot is small,and the processing of small heat affected zone,so it can be super fine marking,special material marking,the marking effect is preferred higher product requirements of customers.
2.紫外激光除銅材質(zhì)外，適合加工的材質(zhì)更加廣泛。不僅光束質(zhì)量好，聚焦光斑更小，能實現(xiàn)超精細標記；
UV laser removal of copper,suitable for processing the material more widely.Not only the beam quality is good,but the focal spot is smaller.
3. 使用范圍更加廣泛；A wider range of applications.
4.熱影響區(qū)域極小，不會產(chǎn)生熱效應(yīng)，不會產(chǎn)生材料燒焦問題；
The heat affected area is very small,will not produce thermal effect,will not produce material burning problem.
5.標記速度快、效率高、整機性能穩(wěn)定，體積小，功耗低等優(yōu)勢。
Marking speed,high efficency,stable performance small size,low power consumption advantages.
激光冷水機組技術(shù)用途 Laser chiller technical use：
在此激光器頻繁運轉(zhuǎn)過程中使用的激光打印功率非常少，所以增加了冷水機組的水頭溫度冷卻使用。更加的增加激光器的壽命時間，保持溫度恒定，提高打印質(zhì)量。
The laser printing power used during the frequent operation of this laser is very small, so the water head temperature of the water chiller is additionally used for cooling. The life time of the laser is further increased, the temperature is kept constant, and the print quality is improved.
產(chǎn)品參數(shù) / Product parameters
| 參數(shù) Parameter | 規(guī)格 Specification | |
| 設(shè)備尺寸 Machine Size | 長(L)980*寬(W)500*高1440(H)mm | |
| 激光中心波長 Laser Wavelenth | 355nm | |
| 激光功率 Laser Power | 5W | |
| 激光輸出模式 Transverse Mode | TEMooz | |
| 脈沖重復(fù)頻率 Pulse Repetition Rate | 20-100kHz | |
| 光速質(zhì)量 Speed of light | M2<1.2 | |
| 脈沖穩(wěn)定性 Pulse-to-Pulse Stability @30KHz | <3% RMS | |
| 脈沖寬度 Pulse Width @20KHz | <15ns | |
| 雕刻面積 Carving Area | 70*70mm,100*100mm,150*150mm | |
| 工作環(huán)境溫度 Operating Ambiernt Temperature | 0 to 40 ℃ | |
| 冷卻方式 Cooling Method | 水冷 Water cooling | |
| 整機功耗 Machine Power Consumption | 600W | |
| 工作電壓 Operating Voltage | AC220V,50Hz | |
行業(yè)應(yīng)用
Industry application
可廣泛應(yīng)用于硅晶、薄片陶瓷、IC晶粒、各種玻璃、TFT、液晶屏、等離子屏、按鍵精細打標、玻璃表面標記、硅片標記、PCB加工、平板顯示器生產(chǎn)、電子元件、太陽能電池材料加工、紡織品、聚合物薄膜等材料的打標和表面處理。Marking and surface treatment of silicon crystal,ceramic,IC grain,all kind of glass,TFT, LCD, plasma screen,key marker,surface marker,surprise glass wafer marking,PCB processing, lat panel display production, electronicn components,trimming solar cell material processing,textile,polymer film and other materials.
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