詳細(xì)介紹
半自動真空晶圓貼膜機STK-7060/STK-7160
半自動真空晶圓貼膜機STK-7060/STK-7160特點:
*的真空安裝技術(shù)
可編程均勻膠帶張力控制
可提供薄晶圓非接觸安裝
全自動送膠帶、貼紙、裁切
晶圓和框架手動裝卸
選配熱控晶圓夾頭
基于PLC的控制,帶5.7英寸觸摸屏
防靜電離子風(fēng)機
舊膠帶和襯板自動復(fù)卷
UV和非UV膠帶安裝
配置4級安全光傳感器
半自動真空晶圓貼膜機STK-7060/STK-7160規(guī)格:
Items STK-7060 STK-7160
Wafer Size Diameter: 6”~8”,Thickness: 100~775um Diameter: 8”~12”,Thickness: 100~775um
Wafer Type Si, GaAs etc., V-Notch or Flat
Tape Type Non-UV / UV tape, width: 240~300mm Non-UV/UV tape, width:300~420mm
Length: 100 m, Thickness: 0.05~0.2mm Length: 100 m, Thickness: 0.05~0.2mm
Frame Type 6”&8”DISCO or K&S 8”&12”DISCO or K&S
Mounting Theory Patented Vacuum Mounting
Input & Output Manual loading & unloading
ESD Control ESD Wafer Chuck / ESD Ion Blower
Cutting System Adjustable Ring Cutter
Control Unit PLC with 5.7” Touch Panel Display
Power Supplier Single Phase AC 220 V, 25A
Air Supplier CDA 5.0 Kgf/cm2, 120 L/min
Dimensions (mm) 800(W)×1200(D)×1750(H)(exclude tower light) 800(W)×1200(D)×1750(H)(exclude tower light)
Net Weight (Kg) 350 380
半自動真空晶圓貼膜機STK-7060/STK-7160相關(guān)產(chǎn)品:
衡鵬供應(yīng)
半自動LED UV照射機STK-1150
半自動晶圓減薄后撕膜機STK-5120
半自動晶圓撕膜機STK-5150
半自動晶圓減薄前貼膜機STK-6020/STK-6120
半自動晶圓減薄貼膜機STK-6050/STK-6150
手動晶圓切割貼膜機STK-7010
半自動晶圓切割貼膜機STK-7120/STK-7020
半自動晶圓切割膜貼膜機STK-7150/STK-7050