3w紅外皮秒光纖激光器GS-PIR3系列(MiniLED)
3w Infrared Picosecond Fiber Laser GS-PIR3 Series
概述 Introduction
應(yīng)用優(yōu)勢(shì)：?jiǎn)?/span>/雙頭輸出，晶圓IR良率高, 12um窄切割道
Advantages: Single/Double head output, LED wafer dicing, High IR yield, 12um narrow street width
技術(shù)指標(biāo)：<15ps, 3w, 50K-200k
Specifications: <15ps, 3w, 50K-200k
主要應(yīng)用：MiniLED、硅、碳化硅等脆性材料切割
Applications: LED Sapphire, Si, Sic and so on brittle material cutting
MiniLED劃片
Wafer dicing/LED sapphire dicing
技術(shù)參數(shù) Specifications
參數(shù) Parameters | 單位 Unit | GS-PIR3/PIR4D |
工作模式 (Working Mode) | 脈沖 (Pulse) | |
中心波長(zhǎng) (Center Wavelength) | nm | 1027-1040 |
輸出功率 (Max Optical Average Power) | W | 3、4（單路2） |
典型輸出功率 (Typical Output Power) | W | 3@100KHz |
脈沖寬度 (Pulse Width) | ps | <15 |
輸出脈沖個(gè)數(shù) (Pulse Number) | 6-13 | |
重復(fù)頻率 (Pulse Repetition Rate) | KHz | 50-200 |
偏振 (Polarization) | 線偏 (linear) | |
消光比 (Extinction Ratio) | dB | ＞ 20 |
脈沖串能量 (Max Pulse train Energy) | uJ | 30 |
光束質(zhì)量M2(Beam Quality M2) | ≤1.2 | |
輸出光斑直徑 (Collimated Beam Diameter) | mm | 5.5±0.3 |
輸出光功率可調(diào)范圍 (Output Power Tunability) | % | 0-100 |
功率穩(wěn)定度 (Power Consumption) | % | <1 |
傳遞光纖長(zhǎng)度 (Delivering Fiber Length) | m | 1 |
工作環(huán)境 Working Conditions | ||
功率消耗 (Power Consumption) | W | 240 |
工作電壓 (Electrical Supply Voltage) | VDC | 24 |
工作溫度 (Operating Temperature) | °C | 20to30 |
存儲(chǔ)溫度 (Storage Temperature) | °C | 0to50 |
體積 (Dimensions)(LxWxH) | mm | 612x430x223 |
重量 (Weight) | kg | 45 |
* 本產(chǎn)品可以根據(jù)客戶要求定制
* Above specifications can be customized for your specific application.
訂購(gòu)信息 Ordering Information
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