YAMAHA-S10/20-3D混合泛用型貼片機(jī) 1、可擴(kuò)展3D MID※貼片 2、強(qiáng)化基板對(duì)應(yīng)能力 3、靈活的元件/種類應(yīng)對(duì)能力 4、支持YAMAHA智慧連線 ※MID:Molded Interconnect Device基本規(guī)格對(duì)象基板 (s10/s20)Min. L50 x W30mm to Max. L1,330 x W510mm Stanard L955 (S10) Min. L50 x W30mm to Max. L1,830 x W510mm Stanard L1,455 (S20)基板厚度0.4-4.8mm基板運(yùn)輸方向左到右(標(biāo)準(zhǔn))基板運(yùn)輸速度Max. 900mm/sec貼裝精度ACHIP +/-0.0040mm貼裝精度BIC +/- 0.025mm貼裝角度+/- 180 degreesZ軸控制/θ軸控制AC 伺服馬達(dá)可貼裝高度Max 30mm (先貼裝元件高度: max 25mm)可貼裝元件0201(mm)-120 x 90mm, BGA, CSP, connector, etc. (Standard 01005-)元件帶回檢知負(fù)壓檢查和圖像檢查元件供給狀態(tài)8-56mm 料帶(F1/F2 送料器), 8-8c8mm 料帶 (F3 電動(dòng)送料器), 桿式送料器, 托盤可安裝送料器數(shù)量Max 90 種(8mm type), 41 lanes x 2 (s10) Max 180 種(8mm type), 45 lanes x 4 (s20)基板傳送高度900 +/-20mm主機(jī)尺寸/重量L1250 x D1750 x H1420mm, Approx. 1,200kg(S10) L1750 x D1750 x H1420mm, Approx. 1,500kg(S10)