詳細(xì)說明

【介紹參數(shù)】

1. 獨(dú)立四電機(jī)驅(qū)動     Independent 4 Drives

_ 為方案提供更多選擇     Provides much option for the best recipe

_ 圖形易于修改         Easy to correct platen figure

2. 研磨盤冷卻系統(tǒng)    Plate Cooling Structure(CMP)

_ 該結(jié)構(gòu)可以很大程度上降低機(jī)械拋光過程中溫度升高對砂輪平面度造成的影響

Maintain Plate flatness management against heat during mechanical polishing.

3. 低振動    Low vibration

_ 高剛性鑄鐵機(jī)身，減少加工震動        Provides stable run for thin applications

4. Hydrostatic base facing unit(DMP)

_ 平面度可達(dá)5um以內(nèi)          Always guarantee the best flatness within 5um

_ 時間節(jié)約:尺寸自動補(bǔ)償系統(tǒng)        Time saving : Self re-conditioning when necessary

5. 壓力控制系統(tǒng)        Air Tube Type pressure control system

_ 加工超薄和易碎產(chǎn)品時可以提供更精確的壓力控制

Provides the suitable pressure control for thin & fragile applications

_ 出色的壓力控制系統(tǒng)，可將加工壓力均勻分配至砂輪盤所有晶片

Excellent resolution of upper pressure Balanced pressure to all batched wafers

6. 采用德制傳輸系統(tǒng)       German made transmission applied

_ 設(shè)備耐用度有保證         Guaranteed machine durability

_ 低故障率 ，低輪齒間隙        Low trouble & Less back-lash